Price search results for HyperX 8GB 2x4GB 2666MHz DDR4 Non ECC CL15 1.2V Memory 

HyperX 8GB (2x4GB) 2666MHz DDR4 Non-ECC CL15 1.2V Memory

HyperX 8GB (2x4GB) 2666MHz DDR4 Non-ECC CL15 1.2V Memory

HyperX HX426C15FBK2/8 is a kit of two 512M x 64-bit (4GB) DDR4-2666 CL15 SDRAM (Synchronous DRAM) 1Rx8, memory module, based on eight...read more

HyperX HX426C15FBK2/8 is a kit of two 512M x 64-bit (4GB) DDR4-2666 CL15 SDRAM (Synchronous DRAM) 1Rx8, memory module, based on eight 512M x 8-bit FBGA components per module. Each module kit supports Intel® Extreme Memory Profiles  Intel® XMP) 2.0. Total kit capacity is 8GB. Each module has been tested to run at DDR4-2666 at a low latency timing of 15-17-17 at 1.2V. Specifications: - CL(IDD) 15 cycles - Row Cycle Time (tRCmin) 45ns(min.) - Refresh to Active/Refresh Command Time (tRFCmin) 260ns(min.) - Row Active Time (tRASmin) 26.25ns(min.) - UL Rating 94 V - 0 - Operating Temperature 0 oC to +85 oC - Storage Temperature -55 oC to +100 oC Features: - Power Supply: VDD = 1.2V Typical - VDDQ = 1.2V Typical - VPP - 2.5V Typical - VDDSPD = 2.2V to 3.6V - Nominal and dynamic on-die termination (ODT) for data, strobe, and mask signals - Low-power auto self refresh (LPASR) - Data bus inversion (DBI) for data bus - On-die VREFDQ generation and calibration - Single-rank - On-board I2 serial presence-detect (SPD) EEPROM - 16 internal banks; 4 groups of 4 banks each - Fixed burst chop (BC) of 4 and burst length (BL) of 8 via the mode register set (MRS) - Selectable BC4 or BL8 on-the-fly (OTF) - Fly-by topology - Terminated control command and address bus - Height 1.340” (34.04mm), w/heatsink
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